Things are going rather slow for the next generation of gaming consoles to arrive because so far we know that the Sony PS5 along with Microsoft Xbox Series X and the rumoured Xbox Series S is coming later this year. However, we say things are slow because the design and specifications of the Sony PS5 and Xbox Series X have been revealed already a month ago and the expected release date could be by the end of this year. Some reports mention that Microsoft is planning to release its console(s) in late November and the same could be said for Sony as well.
In the meanwhile, we are getting more information about the Sony PS5 that is not yet revealed and is worth noting. According to a patent filing found by Dual Shockers, it is found out that the next PlayStation could have a high-end gaming PC level cooling system inside it. This is thanks to the liquid cooling system that these patent filings show.
All this while, Sony has been either using thermal paste or grease to cool down components inside its gaming console but they have their limitations such as reapplying paste or some other problems. With this new liquid cooling system, Sony hopes that the console can keep providing sustained performance under heavy load rather than working on full throttle and then overheating to be affected by “thermal throttling”.
Sony’s patent documents reveal that they “will use a variety of metal alloys” that remain liquid at room temperature and it could be a mixture of silver and copper. Since there is a threat that the liquid could leak into the system over time, Sony is using “ultraviolet cured resin” material to prevent the same.
This liquid cooling system will only be kept inside the heatsink system of the PS5 and other components will still be cooled down by the natural airflow design as well as fans inside the system. It goes without saying that you will still have to keep your PlayStation 5 in a well-ventilated area so that the air flows properly and heat does not get trapped.
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