Yesterday at the IMC 2018 MediaTek’s event, the chipset maker unveiled faster and most advanced SoC i.e. MediaTek Helio P70. As the name suggests, it is the successor to Helio P60. China’s TSMC, which also manufacturers chipsets for Apple and Qualcomm, fabricated the Helio P70 chipset with its 12nm manufacturing process which is recognized as more advanced than its predecessor. This chipset is not only superior to its predecessor but also features a load of smart AI-based features. Just a day-in, the Helio P70 SoC has found its first taker and it’s none other than upcoming RealMe smartphone which will be out early next month.
Upcoming Realme device to sport MediaTek Helio P70 chipset
Realme which is a subsidiary of Oppo has launched several smartphones in last few months including Realme 1, Realme 2, Realme 2 Pro, and Realme C1. A few months ago, it launched its Realme 2 Pro and Realme C1 where the former has a Qualcomm Snapdragon 660 SoC at a cheap price range while the latter had a dual-camera feature at the most affordable price range.
The next Realme smartphone will be powered by Helio P70 SoC which comes with bigger and faster ARM cores optimized for intensive gaming. It’s multi-core Artificial Intelligence Processing (APU) system generates 30% more performance with the bundled MediaTek NeuroPilot technology that quickens processing. The CorePilot 4.0 technology keeps a tap on power requirements and optimizes the cores to provide power and powerful when needed while the chipset practices longer battery life and the capability to perform at peak frequency.
The processor has been optimizing the capture detailed bokeh photos with HDR enhancements and depth-mapping technology for real-time and fluid bokeh effect and a lot more. This would mean that the upcoming Realme will be an even hotter commodity to purchase than all of its predecessors and since it will be launched early next month, we will probably not have to wait much for it.
