- Samsung is reportedly working on a new and improved 2nm manufacturing process for Exynos 2700 SoC arriving later this year.
- The chipset is expected to bring 12% performance gain compared to Exynos 2600 SoC and support to LPPDR6 RAM and UFS 5.0 storage.
- Exynos 2700 SoC is expected to compete against Snapdragon 8 Elite Gen5 paving way for Samsung to use its chipsets on Galaxy S AP.
We just witnessed the unveiling of the Exynos 2600 recently, and now there’s buzz around the new and improved Exynos 2700 SoC. The chipset, fabbed on a 2nm node, is expected to power the Samsung Galaxy S27 Ultra in 2027 and bring an innovative copper-based heat sink design. It is likely to compete head-on with Snapdragon 8 Elite Gen 5 coming later this year, and here’s what we know about it so far.
Gone are the days when Samsung Foundry minted chips with thermal issues and a lower yield rate, especially as compared to TSMC. The Exynos 2600 SoC, which will power the upcoming S26 series, sets a strong foundation for the South Korean chipmaker. It is fabbed on Samsung’s 2nm SF2 node with seemingly better performance than ever before.
Samsung is cooking up the Exynos 2700 SoC to rule
What’s interesting is the fact that Samsung has already begun developing the Exynos 2700 SoC, a chip coming later this year, as per a tipster who goes by the username Kaulenda on X. The new chipset will be based on Samsung’s SF2P process, a next-gen iteration based on a 2nm Gate-All-Around (GAA) process, which helps the chipset improve electrostatic control.
Codenamed Ulysses, the chipset is estimated to bring a 12% hike in gross performance compared to the Exynos 2600 SoC. There’s a 25% reduction in energy consumption as well, and the prime core is clocked at a whopping 4.20GHz. This is a major upgrade over the Exynos 2600 chip’s 3.90GHz clock speed.
Moreover, the Exynos 2700 SoC will enjoy ARM Cortex-C3 cores, LPDDR6 support, and UFS 5.0 storage, resulting in a Geekbench 6 score of 4,800 and 15,000 points on single- and multi-core tests, respectively. That’s a flat 40% and 30% increase, compared to Exynos 2600 chips.
Breaking up the Exynos 2700 SoC
The Exynos 2700 SoC is based on an SF2P process, a 2nm manufacturing process, and a next-gen iteration of the Exynos 2600’s SP2 process. It uses FOWLP-SbS packing technology that brings a copper-based heat sink under DRAM and AP, dubbed the unified Health Path Block (HPB). Here, the block carries out heat dissipation on both DRAM and AP as opposed to only AP on the Exynos 2600.
The upcoming flagship chipset is anticipated to use an AMD-based Xclipse GPU, clubbed with UFS 5.0 and LPDDR6 RAM for faster and more efficient data transmission. The LPDDR6 supports a throughput of up to 14.4 Gbps.
As the Exynos 2700 SoC is reportedly inching closer to the performance compared to the Snapdragon 8 Elite Gen5, Samsung could be working towards dissociating with Qualcomm for its Galaxy S AP in the near future.
