Snapdragon 888+ chipset detailed with X65 5G Modem and 4nm process

Aadil Raval
By Aadil Raval
2 Min Read

Just a few days ago, we got a new Snapdragon chipset listed on GeekBench with a score of 1171 and 3704 points for single-core and multi-core respectively. Cut to now, we have abundant details about the upcoming successor to SD888 which is summoned as Snapdragon 888+. Thanks to the courtesy of tipster Evan Blass, here’s everything that has come to light about the upcoming Plus variant of the flagship chipset.

Snapdragon 888+ or SM8450 is the next-gen chipset from San Diego-based chip manufacturer Qualcomm. The chipset is fabricated on a 4nm processor which makes it powerful and efficient than the 5nm process used in the fabrication of SD888.

According to key details available, the chipset will have a tri-cluster arrangement with a high-performance Kryo 780 core built on Arm Cortex v9 technology taking the helm with a max frequency of 3.0GHz. This pushes the max frequency from 2.4GHz on SD888 to 3.0GHz on SD888+. This falls in line with what you can expect as a plus variant of a flagship chipset.

Qualcomm Snapdragon 8150 SoC gets Bluetooth certification

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Moving on, we have an Adreno 730 GPU mounted on the SoC along with Spectra 680 ISP. The chipset comes integrated with a Snapdragon X65 5G Modem-RF system that can furnish up to 1GHz mmWave and 400MHz Sub-6GHz downlink speeds. It can reach up to 10Gbps of wireless download speeds which is 25 percent greater than what X60 5G modem could reach.

The chipset is all geared up with a new Qualcomm secure processing unit aka SPU260, Adreno 665 video processing unit (VPU), and Adreno 1195 display processing unit (DPU). The chipset further has support for the Qualcomm Aqstic WCD9380/WCD9385 audio codec. It comes strapped with support for quad-channel LPDDR5 package-on-package RAM and Qualcomm FastConnect 6900 subsystem that allows for connectivity feature upgrades such as Wi-Fi 6E and Bluetooth v5.2.

Following the usual launch timeline, we could see Snapdragon SM8450 or SD888+ arrive this July although the date is yet to be revealed.

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Just a few days ago, we got a new Snapdragon chipset listed on GeekBench with a score of 1171 and 3704 points for single-core and multi-core respectively. Cut to now, we have abundant details about the upcoming successor to SD888 which is summoned as Snapdragon 888+. Thanks to the courtesy of tipster Evan Blass, here’s everything that has come to light about the upcoming Plus variant of the flagship chipset.

Snapdragon 888+ or SM8450 is the next-gen chipset from San Diego-based chip manufacturer Qualcomm. The chipset is fabricated on a 4nm processor which makes it powerful and efficient than the 5nm process used in the fabrication of SD888.

According to key details available, the chipset will have a tri-cluster arrangement with a high-performance Kryo 780 core built on Arm Cortex v9 technology taking the helm with a max frequency of 3.0GHz. This pushes the max frequency from 2.4GHz on SD888 to 3.0GHz on SD888+. This falls in line with what you can expect as a plus variant of a flagship chipset.

Qualcomm Snapdragon 8150 SoC gets Bluetooth certification

- Advertisement -

Moving on, we have an Adreno 730 GPU mounted on the SoC along with Spectra 680 ISP. The chipset comes integrated with a Snapdragon X65 5G Modem-RF system that can furnish up to 1GHz mmWave and 400MHz Sub-6GHz downlink speeds. It can reach up to 10Gbps of wireless download speeds which is 25 percent greater than what X60 5G modem could reach.

The chipset is all geared up with a new Qualcomm secure processing unit aka SPU260, Adreno 665 video processing unit (VPU), and Adreno 1195 display processing unit (DPU). The chipset further has support for the Qualcomm Aqstic WCD9380/WCD9385 audio codec. It comes strapped with support for quad-channel LPDDR5 package-on-package RAM and Qualcomm FastConnect 6900 subsystem that allows for connectivity feature upgrades such as Wi-Fi 6E and Bluetooth v5.2.

Following the usual launch timeline, we could see Snapdragon SM8450 or SD888+ arrive this July although the date is yet to be revealed.

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Share This Article
Follow:
A wordsmith, a kin tech observer, a sci-fi fanatic and a scientific documentary buff.
Leave a comment