- The leak suggests Apple is ditching its traditional chip stacking design in favor of TSMC's new WMCM packaging.
- The A20 Pro chip appears to feature a significantly larger Neural Engine than its predecessor.
- Built on TSMC's cutting-edge 2nm process with LPDDR6 memory and a 96-bit memory bus.
As usual, Apple is building anticipation for its annual launch event once again, and this time, the alleged iPhone 18 Pro motherboard leak has surfaced online. Well, that’s purportedly what the leaked images reveal, and fans couldn’t help but get curious about it as soon as they found that this is somehow relating to the company’s upcoming A20-series chip, which is said to be one of the biggest upgrades in Apple history.
According to the image shared by renowned Weibo-based tipsters WHYLAB and Ice Universe, Apple’s upcoming A20 Pro chipset is said to be built using TSMC’s new Wafer-Level Chip Module (WMCM) packaging technology. Even though the leak has not been officially acknowledged by the company. However, recent reports keep indicating that Apple might adapt WMCM for its next-generation chipsets, and it might get real if the leaks are accurate.
iPhone 18 Pro motherboard leak reveals Apple’s plan for its traditional chip design
Until now, Apple has been known for using a Package-on-Package (PoP) design. In this architecture, the DRAM is put exactly on top of the processor. Using this approach, it is beneficial for the system to reduce latency and enhance power efficiency since it keeps the processor and memory physically close.
However, with the new leaked motherboard, Apple seems to be changing its approach with the upcoming A20 Pro chip; now we only have to see if it actually takes a leap forward or if it’s just a strategy game. Anyway, in this design, the new WMCM packaging will purportedly put DRAM beside the chip. By separating the two components, Apple aims to reduce heat buildup near the processor area. Also, it might allow the device to better cool during heavy tasks while maintaining a normal temperature.
In addition to the above claim, the leak also notes the A20 Pro chip will feature LPDDR6 memory connected with a 96-bit memory bus; if the leak turns out to be accurate, the next-gen iPhone will be able to offer faster and more power-efficient memory performance compared to the LPDDR5.
Larger Neural Engine hints at stronger on-device AI
If you look closely at the leaked image, you might notice another significant detail, which is the size of the Neural Processing Unit (NPU), or what Apple calls it, the Apple Neural Engine. Compared to the previous iteration of the Apple chip, the A19 Pro, the A20 Pro’s Neural Engine appears significantly larger, while the overall chip size for both iterations remains unchanged.
Notably, neither the tipsters nor the company has shared any technical specifications as of now. Still, the enlarged NPU size hints at more advanced on-device AI features in upcoming iPhone models. Whatever the outcome is, we advise you to take this with a pinch of salt until Apple officially confirms these details. Considering Apple’s history, I think the company will reveal anything related to upgrades at the annual event, since it makes their event even more exciting.
2nm manufacturing process could boost speed and efficiency
According to previous industry insider reports, the next-generation A20 Pro chip is rumored to be built on TSMC’s 2nm (N2) manufacturing process. Apple is expected to implement significant improvements in both performance and power efficiency compared to its previous chipset.
In addition, the 2nm process is also expected to bring Super High Performance Metal-Insulator-Metal (SHPMIM) capacitors. This is what’s meant to bring better and higher capacitance density than the previous iteration. If this is combined with the WMCM packaging technology, the forthcoming chip could enhance power delivery, improve thermal performance, and increase overall energy efficiency.
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Foldable iPhone and Pro models expected to share the A20 Pro
Well, if you are wondering which iPhone models will equip the upcoming A20 Pro chip, let me break this down to you. The A20 Pro is expected to debut in the iPhone 18 Pro, iPhone 18 Pro Max, and Apple’s rumored foldable iPhone (also known as the iPhone Ultra). Moreover, the three mentioned Apple devices will reportedly include several flagship features, including 12GB of RAM, a 48MP rear camera setup, a next-gen C2 modem, and on-device AI features.
Again, Apple has not officially confirmed any of these specifications. The aforementioned details are based on industry reports and rumors, so they should be treated as unverified until the company makes it official.
For now, the motherboard image leak has given us a first look at Apple’s plan for its next iPhone models. More details are in the pipeline and are expected to be released soon as the company is nearing its iPhone 18 series release.
