Qualcomm’s Snapdragon 8 Elite has only just started to take up residence in markets, but the tech world seems already to have an ear full of leaks about its replacement: Snapdragon 8 Elite 2.
And that’s not all — MediaTek also wants to stir things up with its next-gen Dimensity 9500. According to leaked reports, both chips are set to offer a tremendous performance bump; at least Geekbench 6 single-core scores may jump into the range of about 4,000.
This will translate to a 70% increase in the current value of the Snapdragon 8 Elite, which has brought about 3,200. However, with power comes great responsibility: a call for better cooling solutions—a challenge Qualcomm knows all too well. Here’s what these new chips could bring and their challenges.
MediaTek Dimensity 9500 and Qualcomm Snapdragon 8 Elite 2 Leaked Information with 25% Performance Increase
It won’t be long before tech insider Jukanlosreve’s leaks hint at both Qualcomm Snapdragon 8 Elite 2 and MediaTek Dimensity 9500’s intention to deliver heavyweight single-core scores on the Geekbench 6 benchmark. These numbers, if true, would place the 8 Elite at 3,200, whilst the new generation 8 Elite 2 and Dimensity 9500 is estimated to range around 4,000.
A quarter-performance leap within just one generation is a very radical jump in that regard, which could translate into performance enhancements for demanding applications like high-speed gaming, artificial intelligence processing, or other quite resource-hungry operations.
For users, that’s going to translate into possibly reduced wrenching of heads during multitasking and superfast response times from the next-gen devices. However, that amount of power does not come without its challenges of overheating, something Qualcomm has struggled with in the past.
Those benchmark rumors sound pretty impressively glorious, but maintaining such high speed without overheating is pretty hard for Qualcomm to deal with. Snapdragon 8 Elites, running high clock speeds, tend to get hot under intense usage, which could pose the same thermal issues that the new 8 Elite 2 will have to put up with.
Users already encountered throttling performances in previous models because they got overly heated, especially after a long time of gaming or 4K video streaming. Qualcomm has always modulated the electronics inside its processors to make it a trade-off between power and efficiency.
In this case, with the Snapdragon 8 Elite 2, the firm needs to properly control heat efficiency so that performance won’t be compromised for stability at optimal levels. The tip might benefit from TSMC’s advanced N3P process.
One major feature of the leak is that TSMC-one of the world’s top semiconductor manufacturers ended up being the sole producer of the Snapdragon 8 Elite 2 using its N3P process. N3P is said to be a step above the N3 node on which the current Snapdragon 8 Elite is based, engineered to bring efficiency and heat management to the next level.
If TSMC’s N3P technology could include the proper design for the 8 Elite 2 to manage heat better, sustained performance would be supported, and perhaps even throttling would not be applied as frequently.
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Consumers may enjoy higher power combined with longer battery life where the improvement is particularly marked for activities like gaming, video recording, and applications that demand AR. However, it is too early to know if these new manufacturing methods could overcome the heat-related issues, which are common alongside such increased performance.
These rumors paint a fantastic picture, but it is worth noting that they are still speculations. On our part, as far as we know, Qualcomm has not confirmed any information regarding the Snapdragon 8 Elite 2.
As such, the performance levels and manufacturing decisions we elaborate on here should be taken as possibilities rather than certainties. Even with reliable sources until Qualcomm makes some official word, caution with our expectations is advisable.
