- MediaTek has launched yet new chipsets in the market dubbed as Dimensity 7400 and Dimensity 7400X.
- Both the chipsets are almost identical and based on 4nm node, the same as their predecessors.
- Dimensity 7400 will focus on normal devices while Dimensity 7400X will take on affordable foldable form factors.
Earlier on Tuesday, MediaTek announced a new series of chipsets for mobile devices, the Dimensity 7400 Series. Dubbed Dimensity 7400 and Dimensity 7400X, they appear to share the same architecture as last year’s Dimensity 7300 and Dimensity 7300X. Here’s what you need to know about the latest chipsets.
MediaTek Dimensity 7400 Series Chipsets: Specs & Availability
A new era of chipsets has begun. The latest MediaTek Dimensity 7400 and Dimensity 7400X promise 14% to 36% lower power consumption compared to their predecessors. The only catch? Almost nothing else has changed.
Both chipsets remain largely unchanged from the Dimensity 7300 and Dimensity 7300X, as they are still built on TSMC’s 4nm process and feature an octa-core architecture. The new chipsets include four Cortex-A78 cores clocked at up to 2.6GHz and four Cortex-A55 cores running at 2.0GHz.
They also feature a Mali-G615 MC2 GPU, complemented by MediaTek Advanced Gaming Technology (MAGT) 3.0, which enhances graphics performance, reduces input lag, and leverages AI optimizations to improve gaming experiences. The Dimensity 7400 series now features an integrated NPU 6.0, delivering 15% faster performance in AI applications.
Related
As mentioned earlier, both chipsets are identical except for their target devices. They support up to UFS 3.1 storage, LPDDR5 RAM, up to 200MP camera sensors, and 4K@30fps video recording and playback. Display support includes FHD+ at 144Hz or wide FHD+ at 120Hz.
Apart from that, the connectivity features include a 5G R16 modem with speeds up to 3.27Gbps, Bluetooth v5.4, and Wi-Fi 6E. Additionally, they support multiple satellite navigation systems, including NavIC, Galileo, QZSS, GPS, GLONASS, and BeiDou.
In terms of availability, both chipsets are expected to debut in smartphones this quarter (Q1 2025). The Dimensity 7400 will power standard devices, while the Dimensity 7400X is designed for foldable form factors.
