Slashleaks has posted an inventory of a number of the specs of the upcoming Huawei Mate 40 smartphone. The screenshot reveals that the device has an eight-core HiSilicon Kirin 9000 SoC, from 8 to 12 GB of RAM and 128, 256, or 512 GB of storage memory.
Also mentioned are a non-removable battery, a gravity sensor, a proximity sensor, a light-weight sensor, an acceleration sensor, an electronic compass, fast charging support, a gyroscope, and a fingerprint sensor that’s located under the surface of the screen.
The smartphone should receive a flagship camera. It should a minimum of not be inferior to the Huawei P40 camera, but its specifications haven’t yet been reported. The presentation of Huawei Mate 40 will happen in September this year. the knowledge was personally confirmed by the CEO of Huawei Consumer Business Group Yu Chengdong (Richard Yu).
Now that the second season of flagship smartphones has officially started with the arrival of Samsung’s Galaxy Note 20 family, Huawei is additionally gearing up to announce its H2 flagship within the sort of Huawei Mate 40 series. the primary leaks and reports about the upcoming flagship are already emerging. First of all, it’ll be another powerful camera powerhouse with the superb performance of the newest Kirin chipset. Recently, Richard Yu, President of the Huawei Consumer Business Group, revealed attendees that the Huawei Mate 40 is going to be packing a HiSilicon Kirin chipset. Also, recently, we will just about assume that the Mate 40 with the Kirin 9000 will end the cycle of Kirin-powered flagships.
According to the executive, HiSilicon will not be ready to fabricate Kirin chipsets after September 15, 2020. Now the assembly is rushing to make sure the most important possible amount of Kirin 9000 units before that dead end. the top of Kirin chipsets comes as a result of contract chipmakers aren’t capable of using US-developed technology to fabricate chips for Huawei. This includes TSMC which is behind the manufacture of HiSilicon’s chips. TSMC currently produces all of HiSilicon’s high-end chips for Huawei flagship devices. also as their networking processors for the fifth-gen network support.
Huawei has been running to seek out a viable solution to exchange TSMC. This pursuit resulted during a partnership with the Chinese SMIC which brought the HiSilicon’s Kirin 710A chip. Unfortunately, SMIC is way far away from being capable of manufacturing leading-edge 7nm or 5nm chips. Even modern mid-range phones are already sporting 12nm or maybe 7nm manufacturing processes. After September 15, Huawei won’t have a viable in-house solution to compete within the smartphone market.
