Realme just announced that its upcoming flagship smartphone will be powered by the latest MediaTek Dimensity 1200 SoC under the hood. This comes just a day after MediaTek unveiled its first-ever 6nm chipset aka Dimensity 1200 SoC with a higher frequency and performance compared to the previous 7nm chipsets.
The new Dimensity 1200 chipset is fabricated on a 6nm node similar to Dimensity 1100 chipset also launched together. The chipset has ditched the previous Cortex-A77 high-performance core and instead, it uses a new Cortex-A78 core that offers the highest frequency of 3.0GHz. This translates into 20 percent higher performance than the previous generation of chipsets.
Coming back to Realme’s upcoming smartphone likely to be summoned as Realme X9 Pro, the device will of course feature 5G connectivity. It will have the beef to accelerate performance related to AI with imaging and gaming as well as it will also leverage the more powerful NPU on-board.
According to GSMArena, the Realme X9 will pack in a 6.4-inch OLED panel with a 120Hz refresh rate and with have a resolution of 1080×2400 pixels. The device uses an LPDDR5 RAM of up to 12GB along with 128/256GB of internal storage. Above all, the device will have Realme UI 2.0 based on Android 11 out-of-the-box.
Moving on, the Realme X9 Pro will likely pack in Realme’s first-ever 108MP primary shooter at the back along with two 13MP sensors probably an ultrawide and a telephoto sensor. Finally, we will get a beefy 4,500 mAh battery under the hood and it will be coupled with a 65W fast charging that should charge the battery in half an hour.
Realme is also preparing for yet another flagship phone that will be powered by a Qualcomm Snapdragon 888 chipset under the hood. It is manufactured on a 5nm node which by all means is powerful than the 6nm chipset from MediaTek. Also, it is intriguing as to how Realme is in mode to eliminate using larger nodes, and instead, it will go for the 6nm and 5nm chipsets in the future flagship devices.
