- Dimensity 9500 is expected to deliver a 40% improvement in GPU efficiency over its predecessor, enhancing performance while reducing power consumption.
- Mobile gaming may see a major leap as the chip reportedly enables ray tracing at frame rates above 100fps, offering smoother and more immersive graphics.
- Featuring a Cortex-X930 ultra core and three Cortex-X9 cores, the chip is designed for high-performance tasks, backed by 16MB L3 cache and 10MB system cache.
MediaTek‘s upcoming flagship mobile chipset, MediaTek Dimensity 9500, is expected to be faster and more efficient, especially for gaming and AI. It could deliver a 40% increase in GPU efficiency and handle ray tracing at over 100fps, which would be a big upgrade for mobile gaming.
MediaTek Dimensity 9500 prioritizes GPU efficiency and ray tracing
According to tech insider iIce Universe, MediaTek plans to boost mobile gaming with its new Dimensity 9500 chip. It’s said to have over 40% better GPU efficiency than the Dimensity 9400, thanks to Arm’s next-gen Drage GPU. This upgrade should bring faster performance and better power control.
In addition, Ray tracing, which adds realistic lighting and reflections, is also expected to get a 40% performance boost. This could let mobile games run at over 100fps with ray tracing, making gameplay smoother and more immersive on supported devices.
CPU configuration and AI capabilities
Besides graphics, the Dimensity 9500 is also expected to use a powerful all-big-core CPU setup. Reports say it will include:
- 1x Cortex-X930 ultra core
- 3x Cortex-X9 performance cores
- 4x Cortex-A7 efficiency cores
- 16MB of L3 cache
- 10MB of system-level cache
This setup is made to handle heavy multitasking and demanding apps more efficiently. Early leaks show Geekbench 6 scores of over 3,900 for single-core and 11,000 for multi-core performance, about 34.5% and 19.6% better than the Dimensity 9400.
For AI, the Dimensity 9500 is said to reach up to 100 TOPS (trillion operations per second) using its GPU. This would greatly improve AI features like camera processing, voice recognition, and real-time translation.
Built on TSMC’s advanced 3nm N3P node
The Dimensity 9500 is rumored to be manufactured using TSMC’s 3rd-gen 3nm N3P process, which should offer faster performance and better power efficiency. This move puts MediaTek in line with the industry trend of using advanced chip-making technology to meet the growing need for speed and battery life in smartphones.
Expected launch and device integration
The Dimensity 9500 is anticipated to debut in September 2025, according to the leak. Industry speculation suggests that the Vivo X300 series will be among the first smartphones to feature the new chipset, followed by the Oppo Find X9 lineup. However, MediaTek has not officially confirmed these details.
If the reports are true, the Dimensity 9500 could help MediaTek compete more strongly in the high-end chip market against rivals like Qualcomm’s Snapdragon 8 Gen 4 and Samsung’s Exynos 2500.
